NXP USA Inc. MC33FS6526CAER2

MC33FS6526CAER2


  • Manufacturer: NXP USA Inc.
  • CONEVO NO: MC33FS6526CAER2
  • Package: 48-LQFP Exposed Pad
  • Datasheet: -
  • Stock: In stock
  • Description: MC33FS6526CAER2(Kg)

Details

Tags

Parameters
Mfr NXP USA Inc.
Series Automotive, AEC-Q100
Package Tape & Reel (TR)
Product Status Active
Applications Automotive, System Basis Chip
Current - Supply -
Operating Temperature -40°C ~ 125°C (TA)
Mounting Type Surface Mount
Package / Case 48-LQFP Exposed Pad
Supplier Device Package 48-HLQFP (7x7)
RoHS Status ROHS3 Compliant
Other Names 568-MC33FS6526CAER2TR
Standard Package 2,000
Automotive, System Basis Chip PMIC 48-HLQFP (7x7)
Contact Information
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