NXP USA Inc. MC33FS8430G0ES

MC33FS8430G0ES


  • Manufacturer: NXP USA Inc.
  • CONEVO NO: MC33FS8430G0ES
  • Package: 56-VFQFN Exposed Pad
  • Datasheet: -
  • Stock: In stock
  • Description: MC33FS8430G0ES(Kg)

Details

Tags

Parameters
Mfr NXP USA Inc.
Series -
Package Tray
Product Status Active
Applications System Basis Chip
Current - Supply 15mA
Voltage - Supply 60V
Operating Temperature -40°C ~ 125°C (TA)
Mounting Type Surface Mount, Wettable Flank
Package / Case 56-VFQFN Exposed Pad
Supplier Device Package 56-HVQFN (8x8)
Base Product Number MC33FS8430
RoHS Status ROHS3 Compliant
Moisture Sensitivity Level (MSL) 3 (168 Hours)
REACH Status REACH Unaffected
ECCN EAR99
HTSUS 8542.39.0001
Standard Package 260
System Basis Chip PMIC 56-HVQFN (8x8)
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