NXP USA Inc. MC33HB2000EKR2

MC33HB2000EKR2


  • Manufacturer: NXP USA Inc.
  • CONEVO NO: MC33HB2000EKR2
  • Package: 32-SSOP (0.295", 7.50mm Width) Exposed Pad
  • Datasheet: PDF
  • Stock: In stock
  • Description: MC33HB2000EKR2(Kg)

Details

Tags

Parameters
Mfr NXP USA Inc.
Series -
Package Tape & Reel (TR)
Product Status Active
Output Configuration Half Bridge
Applications DC Motors, General Purpose
Interface Logic, PWM, SPI
Load Type Inductive
Technology Power MOSFET
Rds On (Typ) 235mOhm LS + HS (Max)
Current - Output / Channel 3A
Current - Peak Output 16A
Voltage - Supply 3.3V ~ 5V
Voltage - Load 5V ~ 28V
Operating Temperature -40°C ~ 125°C (TJ)
Features Charge Pump, Slew Rate Controlled, Status Flag
Fault Protection Over Temperature, Short Circuit, UVLO
Mounting Type Surface Mount
Package / Case 32-SSOP (0.295", 7.50mm Width) Exposed Pad
Supplier Device Package 32-SOIC-EP
Base Product Number MC33HB2000
RoHS Status ROHS3 Compliant
Moisture Sensitivity Level (MSL) 3 (168 Hours)
REACH Status REACH Unaffected
ECCN EAR99
HTSUS 8542.39.0001
Other Names 935315555518
Standard Package 1,000
Half Bridge Driver DC Motors, General Purpose Power MOSFET 32-SOIC-EP
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