NXP USA Inc. MC33HB2001EKR2518

MC33HB2001EKR2518


  • Manufacturer: NXP USA Inc.
  • CONEVO NO: MC33HB2001EKR2518
  • Package: 32-SSOP (0.295", 7.50mm Width) Exposed Pad
  • Datasheet: PDF
  • Stock: In stock
  • Description: MC33HB2001EKR2518(Kg)

Details

Tags

Parameters
Mfr NXP USA Inc.
Series -
Package Bulk
Product Status Active
Output Configuration Half Bridge (2)
Applications DC Motors, General Purpose
Interface SPI
Load Type Inductive
Technology Power MOSFET
Rds On (Typ) 125mOhm LS (Max), 125mOhm HS (Max)
Voltage - Supply 5V ~ 28V
Voltage - Load 5V ~ 28V
Operating Temperature -40°C ~ 150°C (TJ)
Features Slew Rate Controlled
Fault Protection Over Temperature, Over Voltage, UVLO
Mounting Type Surface Mount
Package / Case 32-SSOP (0.295", 7.50mm Width) Exposed Pad
Supplier Device Package 32-SOIC-EP
ECCN EAR99
HTSUS 8542.39.0001
Standard Package 1
Half Bridge (2) Driver DC Motors, General Purpose Power MOSFET 32-SOIC-EP
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