NXP USA Inc. MC33PF8200DMES
| Parameters | |
|---|---|
| Mfr | NXP USA Inc. |
| Series | - |
| Package | Tray |
| Product Status | Active |
| Applications | High Performance i.MX 8, S32x Processor Based |
| Current - Supply | - |
| Voltage - Supply | 2.5V ~ 5.5V |
| Operating Temperature | -40°C ~ 105°C (TA) |
| Mounting Type | Surface Mount, Wettable Flank |
| Package / Case | 56-VFQFN Exposed Pad |
| Supplier Device Package | 56-HVQFN (8x8) |
| Base Product Number | MC33PF8200 |
| RoHS Status | ROHS3 Compliant |
| Moisture Sensitivity Level (MSL) | 3 (168 Hours) |
| REACH Status | REACH Unaffected |
| ECCN | EAR99 |
| HTSUS | 8542.39.0001 |
| Standard Package | 260 |
High Performance i.MX 8, S32x Processor Based PMIC 56-HVQFN (8x8)
