NXP USA Inc. MC33PF8200DMES

MC33PF8200DMES


  • Manufacturer: NXP USA Inc.
  • CONEVO NO: MC33PF8200DMES
  • Package: 56-VFQFN Exposed Pad
  • Datasheet: PDF
  • Stock: In stock
  • Description: MC33PF8200DMES(Kg)

Details

Tags

Parameters
Mfr NXP USA Inc.
Series -
Package Tray
Product Status Active
Applications High Performance i.MX 8, S32x Processor Based
Current - Supply -
Voltage - Supply 2.5V ~ 5.5V
Operating Temperature -40°C ~ 105°C (TA)
Mounting Type Surface Mount, Wettable Flank
Package / Case 56-VFQFN Exposed Pad
Supplier Device Package 56-HVQFN (8x8)
Base Product Number MC33PF8200
RoHS Status ROHS3 Compliant
Moisture Sensitivity Level (MSL) 3 (168 Hours)
REACH Status REACH Unaffected
ECCN EAR99
HTSUS 8542.39.0001
Standard Package 260
High Performance i.MX 8, S32x Processor Based PMIC 56-HVQFN (8x8)
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