NXP USA Inc. MC56F8323VFB60

MC56F8323VFB60


  • Manufacturer: NXP USA Inc.
  • CONEVO NO: MC56F8323VFB60
  • Package: 64-LQFP
  • Datasheet: PDF
  • Stock: In stock
  • Description: MC56F8323VFB60(Kg)

Details

Tags

Parameters
Connectivity CANbus, SCI, SPI
Peripherals POR, PWM, Temp Sensor, WDT
Number of I/O 27
Program Memory Size 32KB (16K x 16)
Program Memory Type FLASH
EEPROM Size -
RAM Size 12K x 8
Voltage - Supply (Vcc/Vdd) 2.25V ~ 3.6V
Data Converters A/D 8x12b
Oscillator Type Internal
Operating Temperature -40°C ~ 105°C (TA)
Mounting Type Surface Mount
Package / Case 64-LQFP
Supplier Device Package 64-LQFP (10x10)
Base Product Number MC56F83
RoHS Status RoHS non-compliant
Moisture Sensitivity Level (MSL) 3 (168 Hours)
REACH Status REACH Unaffected
ECCN 3A001A3
HTSUS 8542.31.0001
Standard Package 160
Mfr NXP USA Inc.
Series 56F8xxx
Package Tray
Product Status Obsolete
Core Processor 56800E
Core Size 16-Bit
Speed 60MHz
56800E 56F8xxx Microcontroller IC 16-Bit 60MHz 32KB (16K x 16) FLASH 64-LQFP (10x10)
Contact Information
close