NXP USA Inc. MC68302RC25C

MC68302RC25C


  • Manufacturer: NXP USA Inc.
  • CONEVO NO: MC68302RC25C
  • Package: 132-BPGA Exposed Pad
  • Datasheet: PDF
  • Stock: In stock
  • Description: MC68302RC25C(Kg)

Details

Tags

Parameters
Mfr NXP USA Inc.
Series M683xx
Package Tray
Product Status Obsolete
Core Processor M68000
Number of Cores/Bus Width 1 Core, 8/16-Bit
Speed 25MHz
Co-Processors/DSP Communications; RISC CPM
RAM Controllers DRAM
Graphics Acceleration No
Display & Interface Controllers -
Ethernet -
SATA -
USB -
Voltage - I/O 5.0V
Operating Temperature 0°C ~ 70°C (TA)
Security Features -
Mounting Type Through Hole
Package / Case 132-BPGA Exposed Pad
Supplier Device Package 132-PGA (34.5x34.5)
Additional Interfaces GCI, IDL, ISDN, NMSI, PCM, SCPI
Base Product Number MC683
RoHS Status ROHS3 Compliant
Moisture Sensitivity Level (MSL) 3 (168 Hours)
REACH Status REACH Unaffected
ECCN EAR99
HTSUS 8542.31.0001
Standard Package 28
M68000 Microprocessor IC M683xx 1 Core, 8/16-Bit 25MHz 132-PGA (34.5x34.5)
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