NXP USA Inc. MC68EN360ZQ33L

MC68EN360ZQ33L


  • Manufacturer: NXP USA Inc.
  • CONEVO NO: MC68EN360ZQ33L
  • Package: 357-BBGA
  • Datasheet: PDF
  • Stock: In stock
  • Description: MC68EN360ZQ33L(Kg)

Details

Tags

Parameters
Mfr NXP USA Inc.
Series M683xx
Package Tray
Product Status Obsolete
Core Processor CPU32+
Number of Cores/Bus Width 1 Core, 32-Bit
Speed 33MHz
Co-Processors/DSP Communications; CPM
RAM Controllers DRAM
Graphics Acceleration No
Display & Interface Controllers -
Ethernet 10Mbps (1)
SATA -
USB -
Voltage - I/O 5.0V
Operating Temperature 0°C ~ 70°C (TA)
Security Features -
Mounting Type Surface Mount
Package / Case 357-BBGA
Supplier Device Package 357-PBGA (25x25)
Additional Interfaces SCC, SMC, SPI
Base Product Number MC68
RoHS Status RoHS non-compliant
Moisture Sensitivity Level (MSL) 3 (168 Hours)
REACH Status REACH Unaffected
ECCN 3A991A2
HTSUS 8542.31.0001
Other Names 935318958557
Standard Package 44
CPU32+ Microprocessor IC M683xx 1 Core, 32-Bit 33MHz 357-PBGA (25x25)
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