NXP USA Inc. MC68F375MZP33R2

MC68F375MZP33R2


  • Manufacturer: NXP USA Inc.
  • CONEVO NO: MC68F375MZP33R2
  • Package: 217-BBGA
  • Datasheet: PDF
  • Stock: In stock
  • Description: MC68F375MZP33R2(Kg)

Details

Tags

Parameters
Mfr NXP USA Inc.
Series M683xx
Package Tape & Reel (TR)
Product Status Obsolete
Core Processor CPU32
Core Size 32-Bit Single-Core
Speed 33MHz
Connectivity CANbus, SPI, UART/USART
Peripherals POR, PWM, WDT
Number of I/O 48
Program Memory Size 256KB (256K x 8)
Program Memory Type FLASH
EEPROM Size -
RAM Size 10K x 8
Voltage - Supply (Vcc/Vdd) 3V ~ 5.25V
Data Converters A/D 16x10b
Oscillator Type Internal
Operating Temperature -40°C ~ 125°C (TA)
Mounting Type Surface Mount
Package / Case 217-BBGA
Supplier Device Package 217-PBGA (23x23)
Base Product Number MC68F375
RoHS Status RoHS non-compliant
Moisture Sensitivity Level (MSL) 3 (168 Hours)
REACH Status REACH Unaffected
ECCN 3A991A2
HTSUS 8542.31.0001
Standard Package 500
CPU32 M683xx Microcontroller IC 32-Bit Single-Core 33MHz 256KB (256K x 8) FLASH 217-PBGA (23x23)
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