NXP USA Inc. MC68HC16Z1CAG25

MC68HC16Z1CAG25


  • Manufacturer: NXP USA Inc.
  • CONEVO NO: MC68HC16Z1CAG25
  • Package: 144-LQFP
  • Datasheet: PDF
  • Stock: In stock
  • Description: MC68HC16Z1CAG25(Kg)

Details

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Parameters
Mfr NXP USA Inc.
Series HC16
Package Tray
Product Status Not For New Designs
Core Processor CPU16
Core Size 16-Bit
Speed 25MHz
Connectivity EBI/EMI, SCI, SPI
Peripherals POR, PWM, WDT
Number of I/O 16
Program Memory Size -
Program Memory Type ROMless
EEPROM Size -
RAM Size 1K x 8
Voltage - Supply (Vcc/Vdd) 2.7V ~ 5.5V
Data Converters A/D 8x10b
Oscillator Type Internal
Operating Temperature -40°C ~ 85°C (TA)
Mounting Type Surface Mount
Package / Case 144-LQFP
Supplier Device Package 144-LQFP (20x20)
Base Product Number MC68HC16
RoHS Status ROHS3 Compliant
Moisture Sensitivity Level (MSL) 3 (168 Hours)
REACH Status REACH Unaffected
ECCN EAR99
HTSUS 8542.31.0001
Standard Package 300
CPU16 HC16 Microcontroller IC 16-Bit 25MHz ROMless 144-LQFP (20x20)
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