NXP USA Inc. MC705P6AMDWER

MC705P6AMDWER


  • Manufacturer: NXP USA Inc.
  • CONEVO NO: MC705P6AMDWER
  • Package: 28-SOIC (0.295", 7.50mm Width)
  • Datasheet: -
  • Stock: In stock
  • Description: MC705P6AMDWER(Kg)

Details

Tags

Parameters
Mfr NXP USA Inc.
Series HC05
Package Tape & Reel (TR)
Product Status Not For New Designs
Core Processor HC05
Core Size 8-Bit
Speed 2.1MHz
Connectivity SIO
Peripherals POR, WDT
Number of I/O 21
Program Memory Size 4.5KB (4.5K x 8)
Program Memory Type OTP
EEPROM Size -
RAM Size 176 x 8
Voltage - Supply (Vcc/Vdd) 3V ~ 5.5V
Data Converters A/D 4x8b
Oscillator Type Internal
Operating Temperature -40°C ~ 125°C (TA)
Mounting Type Surface Mount
Package / Case 28-SOIC (0.295", 7.50mm Width)
Supplier Device Package 28-SOIC
Base Product Number MC705
RoHS Status ROHS3 Compliant
Moisture Sensitivity Level (MSL) 3 (168 Hours)
REACH Status REACH Unaffected
ECCN EAR99
HTSUS 8542.31.0001
Other Names 935316546518
Standard Package 1,000
HC05 HC05 Microcontroller IC 8-Bit 2.1MHz 4.5KB (4.5K x 8) OTP 28-SOIC
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