NXP USA Inc. MC9S08AC60MFDE

MC9S08AC60MFDE


  • Manufacturer: NXP USA Inc.
  • CONEVO NO: MC9S08AC60MFDE
  • Package: 48-VFQFN Exposed Pad
  • Datasheet: PDF
  • Stock: In stock
  • Description: MC9S08AC60MFDE(Kg)

Details

Tags

Parameters
Standard Package 260
Mfr NXP USA Inc.
Series S08
Package Tray
Product Status Active
Core Processor S08
Core Size 8-Bit
Speed 40MHz
Connectivity I²C, SCI, SPI
Peripherals LVD, POR, PWM, WDT
Number of I/O 38
Program Memory Size 60KB (60K x 8)
Program Memory Type FLASH
EEPROM Size -
RAM Size 2K x 8
Voltage - Supply (Vcc/Vdd) 2.7V ~ 5.5V
Data Converters A/D 8x10b
Oscillator Type Internal
Operating Temperature -40°C ~ 125°C (TA)
Mounting Type Surface Mount
Package / Case 48-VFQFN Exposed Pad
Supplier Device Package 48-QFN-EP (7x7)
Base Product Number MC9S08
RoHS Status ROHS3 Compliant
Moisture Sensitivity Level (MSL) 3 (168 Hours)
REACH Status REACH Unaffected
ECCN 3A991A2
HTSUS 8542.31.0001
Other Names 935316964557
S08 S08 Microcontroller IC 8-Bit 40MHz 60KB (60K x 8) FLASH 48-QFN-EP (7x7)
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