NXP USA Inc. MC9S08JS8LCWJ

MC9S08JS8LCWJ


  • Manufacturer: NXP USA Inc.
  • CONEVO NO: MC9S08JS8LCWJ
  • Package: 20-SOIC (0.295", 7.50mm Width)
  • Datasheet: PDF
  • Stock: In stock
  • Description: MC9S08JS8LCWJ(Kg)

Details

Tags

Parameters
Operating Temperature -40°C ~ 85°C (TA)
Mounting Type Surface Mount
Package / Case 20-SOIC (0.295", 7.50mm Width)
Supplier Device Package 20-SOIC
Base Product Number MC9S08
RoHS Status ROHS3 Compliant
Moisture Sensitivity Level (MSL) 3 (168 Hours)
REACH Status REACH Unaffected
ECCN 3A991A2
HTSUS 8542.31.0001
Other Names 935310101574
Standard Package 38
Mfr NXP USA Inc.
Series S08
Package Tube
Product Status Active
Core Processor S08
Core Size 8-Bit
Speed 48MHz
Connectivity LINbus, SCI, SPI, USB
Peripherals LVD, POR, PWM
Number of I/O 14
Program Memory Size 8KB (8K x 8)
Program Memory Type FLASH
EEPROM Size -
RAM Size 512 x 8
Voltage - Supply (Vcc/Vdd) 2.7V ~ 5.5V
Data Converters -
Oscillator Type Internal
S08 S08 Microcontroller IC 8-Bit 48MHz 8KB (8K x 8) FLASH 20-SOIC
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