NXP USA Inc. MC9S08LH64CLK

MC9S08LH64CLK


  • Manufacturer: NXP USA Inc.
  • CONEVO NO: MC9S08LH64CLK
  • Package: 80-LQFP
  • Datasheet: PDF
  • Stock: In stock
  • Description: MC9S08LH64CLK(Kg)

Details

Tags

Parameters
Operating Temperature -40°C ~ 85°C (TA)
Mounting Type Surface Mount
Package / Case 80-LQFP
Supplier Device Package 80-LQFP (14x14)
Base Product Number MC9S08
RoHS Status ROHS3 Compliant
Moisture Sensitivity Level (MSL) 3 (168 Hours)
REACH Status REACH Unaffected
ECCN 3A991A2
HTSUS 8542.31.0001
Other Names 935322942557
Standard Package 450
Mfr NXP USA Inc.
Series S08
Package Tray
Product Status Active
Core Processor S08
Core Size 8-Bit
Speed 40MHz
Connectivity I²C, LINbus, SPI, UART/USART
Peripherals LCD, LVD, PWM, WDT
Number of I/O 39
Program Memory Size 64KB (64K x 8)
Program Memory Type FLASH
EEPROM Size -
RAM Size 4K x 8
Voltage - Supply (Vcc/Vdd) 1.8V ~ 3.6V
Data Converters A/D 8x16b
Oscillator Type Internal
S08 S08 Microcontroller IC 8-Bit 40MHz 64KB (64K x 8) FLASH 80-LQFP (14x14)
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