NXP USA Inc. MC9S08PA4VWJ

MC9S08PA4VWJ


  • Manufacturer: NXP USA Inc.
  • CONEVO NO: MC9S08PA4VWJ
  • Package: 20-SOIC (0.295", 7.50mm Width)
  • Datasheet: PDF
  • Stock: In stock
  • Description: MC9S08PA4VWJ(Kg)

Details

Tags

Parameters
Mfr NXP USA Inc.
Series S08
Package Tube
Product Status Not For New Designs
Core Processor S08
Core Size 8-Bit
Speed 20MHz
Connectivity LINbus, SPI, UART/USART
Peripherals LVD, POR, PWM, WDT
Number of I/O 18
Program Memory Size 4KB (4K x 8)
Program Memory Type FLASH
EEPROM Size 128 x 8
RAM Size 512 x 8
Voltage - Supply (Vcc/Vdd) 2.7V ~ 5.5V
Data Converters A/D 8x12b
Oscillator Type Internal
Operating Temperature -40°C ~ 105°C (TA)
Mounting Type Surface Mount
Package / Case 20-SOIC (0.295", 7.50mm Width)
Supplier Device Package 20-SOIC
Base Product Number MC9S08
RoHS Status ROHS3 Compliant
Moisture Sensitivity Level (MSL) 3 (168 Hours)
REACH Status REACH Unaffected
ECCN 3A991A2
HTSUS 8542.31.0001
Standard Package 38
S08 S08 Microcontroller IC 8-Bit 20MHz 4KB (4K x 8) FLASH 20-SOIC
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