NXP USA Inc. MC9S08PB16MTJ

MC9S08PB16MTJ


  • Manufacturer: NXP USA Inc.
  • CONEVO NO: MC9S08PB16MTJ
  • Package: 20-TSSOP (0.173", 4.40mm Width)
  • Datasheet: PDF
  • Stock: In stock
  • Description: MC9S08PB16MTJ(Kg)

Details

Tags

Parameters
Mfr NXP USA Inc.
Series S08
Package Tray
Product Status Active
Core Processor S08
Core Size 8-Bit
Speed 20MHz
Connectivity I²C, LINbus, SPI, UART/USART
Peripherals LVD, POR, PWM, WDT
Number of I/O 18
Program Memory Size 16KB (16K x 8)
Program Memory Type FLASH
EEPROM Size -
RAM Size 1K x 8
Voltage - Supply (Vcc/Vdd) 2.7V ~ 5.5V
Data Converters A/D 12x12b
Oscillator Type External
Operating Temperature -40°C ~ 125°C (TA)
Mounting Type Surface Mount
Package / Case 20-TSSOP (0.173", 4.40mm Width)
Supplier Device Package 20-TSSOP
Base Product Number MC9S08
RoHS Status ROHS3 Compliant
Moisture Sensitivity Level (MSL) 3 (168 Hours)
REACH Status REACH Unaffected
ECCN 3A991A2
HTSUS 8542.31.0001
Standard Package 75
S08 S08 Microcontroller IC 8-Bit 20MHz 16KB (16K x 8) FLASH 20-TSSOP
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