NXP USA Inc. MC9S08QG8CFKE,557

MC9S08QG8CFKE,557


  • Manufacturer: NXP USA Inc.
  • CONEVO NO: MC9S08QG8CFKE,557
  • Package: 24-VFQFN Exposed Pad
  • Datasheet: PDF
  • Stock: In stock
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Details

Tags

Parameters
Mfr NXP USA Inc.
Series S08
Package Tray
Product Status Active
Core Processor S08
Core Size 8-Bit
Speed 20MHz
Connectivity I²C, SCI, SPI
Peripherals LVD, POR, PWM, WDT
Number of I/O 12
Program Memory Size 8KB (8K x 8)
Program Memory Type FLASH
EEPROM Size -
RAM Size 512 x 8
Voltage - Supply (Vcc/Vdd) 1.8V ~ 3.6V
Data Converters A/D 8x10b
Oscillator Type Internal
Operating Temperature -40°C ~ 85°C (TA)
Mounting Type Surface Mount
Package / Case 24-VFQFN Exposed Pad
Supplier Device Package 24-QFN-EP (4x4)
Base Product Number MC9S08
RoHS Status Not applicable
Moisture Sensitivity Level (MSL) 3 (168 Hours)
REACH Status Vendor Undefined
Standard Package 1
S08 S08 Microcontroller IC 8-Bit 20MHz 8KB (8K x 8) FLASH 24-QFN-EP (4x4)
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