NXP USA Inc. MC9S08RG32FGE

MC9S08RG32FGE


  • Manufacturer: NXP USA Inc.
  • CONEVO NO: MC9S08RG32FGE
  • Package: 44-LQFP
  • Datasheet: -
  • Stock: In stock
  • Description: MC9S08RG32FGE(Kg)

Details

Tags

Parameters
Number of I/O 39
Program Memory Size 32KB (32K x 8)
Program Memory Type FLASH
EEPROM Size -
RAM Size 2K x 8
Voltage - Supply (Vcc/Vdd) 1.8V ~ 3.6V
Data Converters -
Oscillator Type External, Internal
Operating Temperature 0°C ~ 70°C (TA)
Mounting Type Surface Mount
Package / Case 44-LQFP
Supplier Device Package 44-LQFP (10x10)
Base Product Number MC9S08
RoHS Status ROHS3 Compliant
Moisture Sensitivity Level (MSL) 3 (168 Hours)
REACH Status REACH info available upon request
ECCN EAR99
HTSUS 8542.31.0000
Other Names 2832-MC9S08RG32FGE
Standard Package 160
Mfr NXP USA Inc.
Series HCS08
Package Tray
Product Status Active
Core Processor HCS08
Core Size 8-Bit
Speed 8MHz
Connectivity SCI, SPI
Peripherals LVD, POR, PWM, WDT
HCS08 HCS08 Microcontroller IC 8-Bit 8MHz 32KB (32K x 8) FLASH 44-LQFP (10x10)
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