NXP USA Inc. MC9S08SH4MPJ

MC9S08SH4MPJ


  • Manufacturer: NXP USA Inc.
  • CONEVO NO: MC9S08SH4MPJ
  • Package: 20-DIP (0.300", 7.62mm)
  • Datasheet: -
  • Stock: In stock
  • Description: MC9S08SH4MPJ(Kg)

Details

Tags

Parameters
Mfr NXP USA Inc.
Series S08
Package Tube
Product Status Obsolete
Core Processor S08
Core Size 8-Bit
Speed 40MHz
Connectivity I²C, LINbus, SCI, SPI
Peripherals LVD, POR, PWM, WDT
Number of I/O 17
Program Memory Size 4KB (4K x 8)
Program Memory Type FLASH
EEPROM Size -
RAM Size 256 x 8
Voltage - Supply (Vcc/Vdd) 2.7V ~ 5.5V
Data Converters A/D 12x10b
Oscillator Type Internal
Operating Temperature -40°C ~ 125°C (TA)
Mounting Type Through Hole
Package / Case 20-DIP (0.300", 7.62mm)
Supplier Device Package 20-DIP
Base Product Number MC9S08
RoHS Status ROHS3 Compliant
Moisture Sensitivity Level (MSL) Not Applicable
REACH Status REACH Unaffected
ECCN 3A991A2
HTSUS 8542.31.0001
Standard Package 18
S08 S08 Microcontroller IC 8-Bit 40MHz 4KB (4K x 8) FLASH 20-DIP
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