NXP USA Inc. MC9S12DG128VPVE

MC9S12DG128VPVE


  • Manufacturer: NXP USA Inc.
  • CONEVO NO: MC9S12DG128VPVE
  • Package: 112-LQFP
  • Datasheet: PDF
  • Stock: In stock
  • Description: MC9S12DG128VPVE(Kg)

Details

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Parameters
Mfr NXP USA Inc.
Series HCS12
Package Tray
Product Status Active
Core Processor HCS12
Core Size 16-Bit
Speed 25MHz
Connectivity CANbus, I²C, SCI, SPI
Peripherals PWM, WDT
Number of I/O 91
Program Memory Size 128KB (128K x 8)
Program Memory Type FLASH
EEPROM Size 2K x 8
RAM Size 8K x 8
Voltage - Supply (Vcc/Vdd) 2.35V ~ 5.25V
Data Converters A/D 16x10b
Oscillator Type Internal
Operating Temperature -40°C ~ 105°C (TA)
Mounting Type Surface Mount
Package / Case 112-LQFP
Supplier Device Package 112-LQFP (20x20)
Base Product Number MC9S12
RoHS Status ROHS3 Compliant
Moisture Sensitivity Level (MSL) 3 (168 Hours)
REACH Status REACH Unaffected
ECCN EAR99
HTSUS 8542.31.0001
Standard Package 300
HCS12 HCS12 Microcontroller IC 16-Bit 25MHz 128KB (128K x 8) FLASH 112-LQFP (20x20)
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