NXP USA Inc. MC9S12DT256MPVE

MC9S12DT256MPVE


  • Manufacturer: NXP USA Inc.
  • CONEVO NO: MC9S12DT256MPVE
  • Package: 112-LQFP
  • Datasheet: PDF
  • Stock: In stock
  • Description: MC9S12DT256MPVE(Kg)

Details

Tags

Parameters
Mfr NXP USA Inc.
Series HCS12
Package Tray
Product Status Active
Core Processor HCS12
Core Size 16-Bit
Speed 25MHz
Connectivity CANbus, I²C, SCI, SPI
Peripherals PWM, WDT
Number of I/O 91
Program Memory Size 256KB (256K x 8)
Program Memory Type FLASH
EEPROM Size 4K x 8
RAM Size 12K x 8
Voltage - Supply (Vcc/Vdd) 2.35V ~ 5.25V
Data Converters A/D 8x10b
Oscillator Type Internal
Operating Temperature -40°C ~ 125°C (TA)
Mounting Type Surface Mount
Package / Case 112-LQFP
Supplier Device Package 112-LQFP (20x20)
Base Product Number MC9S12
RoHS Status ROHS3 Compliant
Moisture Sensitivity Level (MSL) 3 (168 Hours)
REACH Status REACH Unaffected
ECCN 3A991A2
HTSUS 8542.31.0001
Standard Package 300
HCS12 HCS12 Microcontroller IC 16-Bit 25MHz 256KB (256K x 8) FLASH 112-LQFP (20x20)
Contact Information
close