NXP USA Inc. MC9S12XDG128MAL

MC9S12XDG128MAL


  • Manufacturer: NXP USA Inc.
  • CONEVO NO: MC9S12XDG128MAL
  • Package: 112-LQFP
  • Datasheet: PDF
  • Stock: In stock
  • Description: MC9S12XDG128MAL(Kg)

Details

Tags

Parameters
Mfr NXP USA Inc.
Series HCS12X
Package Tray
Product Status Not For New Designs
Core Processor HCS12X
Core Size 16-Bit
Speed 80MHz
Connectivity CANbus, EBI/EMI, I²C, IrDA, LINbus, SCI, SPI
Peripherals LVD, POR, PWM, WDT
Number of I/O 91
Program Memory Size 128KB (128K x 8)
Program Memory Type FLASH
EEPROM Size 2K x 8
RAM Size 12K x 8
Voltage - Supply (Vcc/Vdd) 2.35V ~ 5.5V
Data Converters A/D 16x10b
Oscillator Type External
Operating Temperature -40°C ~ 125°C (TA)
Mounting Type Surface Mount
Package / Case 112-LQFP
Supplier Device Package 112-LQFP (20x20)
Base Product Number MC9S12
RoHS Status ROHS3 Compliant
Moisture Sensitivity Level (MSL) 3 (168 Hours)
REACH Status REACH Unaffected
ECCN 3A991A2
HTSUS 8542.31.0001
Other Names 935325227557
Standard Package 300
HCS12X HCS12X Microcontroller IC 16-Bit 80MHz 128KB (128K x 8) FLASH 112-LQFP (20x20)
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