NXP USA Inc. MCF5307FT66B

MCF5307FT66B


  • Manufacturer: NXP USA Inc.
  • CONEVO NO: MCF5307FT66B
  • Package: 208-BFQFP
  • Datasheet: PDF
  • Stock: In stock
  • Description: MCF5307FT66B(Kg)

Details

Tags

Parameters
Mfr NXP USA Inc.
Series MCF530x
Package Tray
Product Status Obsolete
Core Processor Coldfire V3
Core Size 32-Bit Single-Core
Speed 66MHz
Connectivity EBI/EMI, I²C, UART/USART
Peripherals DMA, POR, WDT
Number of I/O 16
Program Memory Size -
Program Memory Type ROMless
EEPROM Size -
RAM Size 4K x 8
Voltage - Supply (Vcc/Vdd) 3V ~ 3.6V
Data Converters -
Oscillator Type External
Operating Temperature 0°C ~ 70°C (TA)
Mounting Type Surface Mount
Package / Case 208-BFQFP
Supplier Device Package 208-FQFP (28x28)
Base Product Number MCF5307
RoHS Status RoHS non-compliant
Moisture Sensitivity Level (MSL) 3 (168 Hours)
REACH Status REACH Unaffected
ECCN 3A001A3
HTSUS 8542.31.0001
Standard Package 24
Coldfire V3 MCF530x Microcontroller IC 32-Bit Single-Core 66MHz ROMless 208-FQFP (28x28)
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