NXP USA Inc. MCF54454VR266

MCF54454VR266


  • Manufacturer: NXP USA Inc.
  • CONEVO NO: MCF54454VR266
  • Package: 360-BBGA
  • Datasheet: PDF
  • Stock: In stock
  • Description: MCF54454VR266(Kg)

Details

Tags

Parameters
Voltage - Supply (Vcc/Vdd) 1.35V ~ 3.6V
Data Converters -
Oscillator Type Internal
Operating Temperature 0°C ~ 70°C (TA)
Mounting Type Surface Mount
Package / Case 360-BBGA
Supplier Device Package 360-TEPBGA (23x23)
Base Product Number MCF54454
RoHS Status ROHS3 Compliant
Moisture Sensitivity Level (MSL) 3 (168 Hours)
REACH Status REACH Unaffected
ECCN 5A002A1
HTSUS 8542.31.0001
Other Names 935316957557
Standard Package 300
Mfr NXP USA Inc.
Series MCF5445x
Package Tray
Product Status Obsolete
Core Processor Coldfire V4
Core Size 32-Bit Single-Core
Speed 266MHz
Connectivity I²C, SPI, SSI, UART/USART, USB OTG
Peripherals DMA, WDT
Number of I/O 132
Program Memory Size -
Program Memory Type ROMless
EEPROM Size -
RAM Size 32K x 8
Coldfire V4 MCF5445x Microcontroller IC 32-Bit Single-Core 266MHz ROMless 360-TEPBGA (23x23)
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