NXP USA Inc. MCF54455CVP200

MCF54455CVP200


  • Manufacturer: NXP USA Inc.
  • CONEVO NO: MCF54455CVP200
  • Package: 360-BBGA
  • Datasheet: PDF
  • Stock: In stock
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Details

Tags

Parameters
Mfr NXP USA Inc.
Series MCF5445x
Package Tray
Product Status Active
Core Processor Coldfire V4
Core Size 32-Bit Single-Core
Speed 200MHz
Connectivity I²C, SPI, SSI, UART/USART, USB OTG
Peripherals DMA, WDT
Number of I/O 132
Program Memory Size -
Program Memory Type ROMless
EEPROM Size -
RAM Size 32K x 8
Voltage - Supply (Vcc/Vdd) 1.35V ~ 3.6V
Data Converters -
Oscillator Type External, Internal
Operating Temperature -40°C ~ 85°C (TA)
Mounting Type Surface Mount
Package / Case 360-BBGA
Supplier Device Package 360-BGA (23x23)
Base Product Number MCF54455
RoHS Status ROHS3 Compliant
Moisture Sensitivity Level (MSL) 3 (168 Hours)
REACH Status REACH Unaffected
Standard Package 300
Coldfire V4 MCF5445x Microcontroller IC 32-Bit Single-Core 200MHz ROMless 360-BGA (23x23)
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