NXP USA Inc. MCIMX233DJM4CR2

MCIMX233DJM4CR2


  • Manufacturer: NXP USA Inc.
  • CONEVO NO: MCIMX233DJM4CR2
  • Package: 169-LFBGA
  • Datasheet: PDF
  • Stock: In stock
  • Description: MCIMX233DJM4CR2(Kg)

Details

Tags

Parameters
Mfr NXP USA Inc.
Series i.MX23
Package Tape & Reel (TR)
Product Status Active
Core Processor ARM926EJ-S
Number of Cores/Bus Width 1 Core, 32-Bit
Speed 454MHz
Co-Processors/DSP Data; DCP
RAM Controllers DRAM
Graphics Acceleration No
Display & Interface Controllers LCD, Touchscreen
Ethernet -
SATA -
USB USB 2.0 + PHY (1)
Voltage - I/O 2.0V, 2.5V, 2.7V, 3.0V, 3.3V
Operating Temperature -10°C ~ 70°C (TA)
Security Features Cryptography, Hardware ID
Mounting Type Surface Mount
Package / Case 169-LFBGA
Supplier Device Package 169-MAPBGA (11x11)
Additional Interfaces I²C, I²S, MMC/SD/SDIO, SAI, SPI, SSI, SSP, UART
Base Product Number MCIMX233
RoHS Status ROHS3 Compliant
Moisture Sensitivity Level (MSL) 3 (168 Hours)
REACH Status REACH Unaffected
ECCN 5A002A1
HTSUS 8542.31.0001
Standard Package 1,500
ARM926EJ-S Microprocessor IC i.MX23 1 Core, 32-Bit 454MHz 169-MAPBGA (11x11)
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