NXP USA Inc. MCIMX535DVV2C

MCIMX535DVV2C


  • Manufacturer: NXP USA Inc.
  • CONEVO NO: MCIMX535DVV2C
  • Package: 529-FBGA
  • Datasheet: PDF
  • Stock: In stock
  • Description: MCIMX535DVV2C(Kg)

Details

Tags

Parameters
REACH Status REACH Unaffected
ECCN 3A991A2
HTSUS 8542.31.0001
Other Names 935319813557
Standard Package 420
Mfr NXP USA Inc.
Series i.MX53
Package Tray
Product Status Obsolete
Core Processor ARM® Cortex®-A8
Number of Cores/Bus Width 1 Core, 32-Bit
Speed 1.2GHz
Co-Processors/DSP Multimedia; NEON™ SIMD
RAM Controllers LPDDR2, DDR2, DDR3
Graphics Acceleration Yes
Display & Interface Controllers Keypad, LCD
Ethernet 10/100Mbps (1)
SATA SATA 1.5Gbps (1)
USB USB 2.0 (2), USB 2.0 + PHY (2)
Voltage - I/O 1.3V, 1.8V, 2.775V, 3.3V
Operating Temperature -20°C ~ 85°C (TC)
Security Features ARM TZ, Boot Security, Cryptography, RTIC, Secure Fusebox, Secure JTAG, Secure Memory, Secure RTC, Tamper Detection
Mounting Type Surface Mount
Package / Case 529-FBGA
Supplier Device Package 529-FBGA (19x19)
Additional Interfaces 1-Wire, AC'97, CAN, I²C, I²S, MMC/SD, SAI, SPI, SSI, UART
Base Product Number MCIMX535
RoHS Status ROHS3 Compliant
Moisture Sensitivity Level (MSL) 3 (168 Hours)
ARM® Cortex®-A8 Microprocessor IC i.MX53 1 Core, 32-Bit 1.2GHz 529-FBGA (19x19)
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