NXP USA Inc. MCIMX535DVV2C

MCIMX535DVV2C


  • Manufacturer: NXP USA Inc.
  • CONEVO NO: MCIMX535DVV2C
  • Package: 529-FBGA
  • Datasheet: PDF
  • Stock: In stock
  • Description: MCIMX535DVV2C(Kg)
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Parameters
REACH Status REACH Unaffected
ECCN 3A991A2
HTSUS 8542.31.0001
Other Names 935319813557
Standard Package 420
Mfr NXP USA Inc.
Series i.MX53
Package Tray
Product Status Obsolete
Core Processor ARM® Cortex®-A8
Number of Cores/Bus Width 1 Core, 32-Bit
Speed 1.2GHz
Co-Processors/DSP Multimedia; NEON™ SIMD
RAM Controllers LPDDR2, DDR2, DDR3
Graphics Acceleration Yes
Display & Interface Controllers Keypad, LCD
Ethernet 10/100Mbps (1)
SATA SATA 1.5Gbps (1)
USB USB 2.0 (2), USB 2.0 + PHY (2)
Voltage - I/O 1.3V, 1.8V, 2.775V, 3.3V
Operating Temperature -20°C ~ 85°C (TC)
Security Features ARM TZ, Boot Security, Cryptography, RTIC, Secure Fusebox, Secure JTAG, Secure Memory, Secure RTC, Tamper Detection
Mounting Type Surface Mount
Package / Case 529-FBGA
Supplier Device Package 529-FBGA (19x19)
Additional Interfaces 1-Wire, AC'97, CAN, I²C, I²S, MMC/SD, SAI, SPI, SSI, UART
Base Product Number MCIMX535
RoHS Status ROHS3 Compliant
Moisture Sensitivity Level (MSL) 3 (168 Hours)
ARM® Cortex®-A8 Microprocessor IC i.MX53 1 Core, 32-Bit 1.2GHz 529-FBGA (19x19)
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