NXP USA Inc. MCIMX537CVV8C2

MCIMX537CVV8C2


  • Manufacturer: NXP USA Inc.
  • CONEVO NO: MCIMX537CVV8C2
  • Package: 529-FBGA
  • Datasheet: -
  • Stock: In stock
  • Description: MCIMX537CVV8C2(Kg)

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Parameters
Mfr NXP USA Inc.
Series i.MX53
Package Tray
Product Status Obsolete
Core Processor ARM® Cortex®-A8
Number of Cores/Bus Width 1 Core, 32-Bit
Speed 800MHz
Co-Processors/DSP Multimedia; NEON™ SIMD
RAM Controllers LPDDR2, DDR2, DDR3
Graphics Acceleration Yes
Display & Interface Controllers Keypad, LCD
Ethernet 10/100Mbps (1)
SATA SATA 1.5Gbps (1)
USB USB 2.0 (2), USB 2.0 + PHY (2)
Voltage - I/O 1.3V, 1.8V, 2.775V, 3.3V
Operating Temperature -40°C ~ 85°C (TA)
Security Features ARM TZ, Boot Security, Cryptography, RTIC, Secure Fusebox, Secure JTAG, Secure Memory, Secure RTC, Tamper Detection
Mounting Type Surface Mount
Package / Case 529-FBGA
Supplier Device Package 529-FBGA (19x19)
Additional Interfaces 1-Wire, AC'97, CAN, I²C, I²S, MMC/SD, SAI, SPI, SSI, UART
Base Product Number MCIMX537
RoHS Status ROHS3 Compliant
Moisture Sensitivity Level (MSL) 3 (168 Hours)
REACH Status REACH Unaffected
ECCN 5A992C
HTSUS 8542.31.0001
Standard Package 84
ARM® Cortex®-A8 Microprocessor IC i.MX53 1 Core, 32-Bit 800MHz 529-FBGA (19x19)
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