NXP USA Inc. MCR705JP7CDWE

MCR705JP7CDWE


  • Manufacturer: NXP USA Inc.
  • CONEVO NO: MCR705JP7CDWE
  • Package: 28-SOIC (0.295", 7.50mm Width)
  • Datasheet: PDF
  • Stock: In stock
  • Description: MCR705JP7CDWE(Kg)

Details

Tags

Parameters
Mfr NXP USA Inc.
Series HC05
Package Bulk
Product Status Obsolete
Core Processor HC05
Core Size 8-Bit
Speed 2.1MHz
Connectivity SIO
Peripherals POR, Temp Sensor, WDT
Number of I/O 22
Program Memory Size 6KB (6K x 8)
Program Memory Type OTP
EEPROM Size -
RAM Size 224 x 8
Voltage - Supply (Vcc/Vdd) 2.7V ~ 5.5V
Data Converters A/D 4x12b
Oscillator Type Internal
Operating Temperature -40°C ~ 85°C (TA)
Mounting Type Surface Mount
Package / Case 28-SOIC (0.295", 7.50mm Width)
Supplier Device Package 28-SOIC
Base Product Number MCR705
RoHS Status RoHS non-compliant
ECCN EAR99
HTSUS 8542.31.0001
Other Names 2832-MCR705JP7CDWE
Standard Package 1
HC05 HC05 Microcontroller IC 8-Bit 2.1MHz 6KB (6K x 8) OTP 28-SOIC
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