NXP USA Inc. MCZ33889DEGR2

MCZ33889DEGR2


  • Manufacturer: NXP USA Inc.
  • CONEVO NO: MCZ33889DEGR2
  • Package: 28-SOIC (0.295", 7.50mm Width)
  • Datasheet: PDF
  • Stock: In stock
  • Description: MCZ33889DEGR2(Kg)

Details

Tags

Parameters
Mfr NXP USA Inc.
Series -
Package Tape & Reel (TR)
Product Status Obsolete
Applications System Basis Chip
Interface CAN, SPI
Voltage - Supply 5.5V ~ 18V
Package / Case 28-SOIC (0.295", 7.50mm Width)
Supplier Device Package 28-SOIC
Mounting Type Surface Mount
Base Product Number MCZ33
RoHS Status ROHS3 Compliant
Moisture Sensitivity Level (MSL) 3 (168 Hours)
REACH Status REACH Unaffected
ECCN EAR99
HTSUS 8542.31.0001
Standard Package 1,000
System Basis Chip Interface 28-SOIC
Contact Information
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