NXP USA Inc. MCZ33903DS5EKR2

MCZ33903DS5EKR2


  • Manufacturer: NXP USA Inc.
  • CONEVO NO: MCZ33903DS5EKR2
  • Package: 32-SSOP (0.295", 7.50mm Width) Exposed Pad
  • Datasheet: PDF
  • Stock: In stock
  • Description: MCZ33903DS5EKR2(Kg)

Details

Tags

Parameters
Mfr NXP USA Inc.
Series -
Package Tape & Reel (TR)
Product Status Active
Applications System Basis Chip
Interface CAN, LIN
Voltage - Supply 5.5V ~ 28V
Package / Case 32-SSOP (0.295", 7.50mm Width) Exposed Pad
Supplier Device Package 32-SSOP-EP
Mounting Type Surface Mount
Base Product Number MCZ33903
RoHS Status ROHS3 Compliant
Moisture Sensitivity Level (MSL) 3 (168 Hours)
REACH Status REACH Unaffected
ECCN EAR99
HTSUS 8542.39.0001
Other Names 935333189518
Standard Package 1,000
System Basis Chip Interface 32-SSOP-EP
Contact Information
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