NXP USA Inc. MCZ33904B3EKR2

MCZ33904B3EKR2


  • Manufacturer: NXP USA Inc.
  • CONEVO NO: MCZ33904B3EKR2
  • Package: 32-SSOP (0.295", 7.50mm Width) Exposed Pad
  • Datasheet: PDF
  • Stock: In stock
  • Description: MCZ33904B3EKR2(Kg)

Details

Tags

Parameters
Mfr NXP USA Inc.
Series -
Package Tape & Reel (TR)
Product Status Obsolete
Applications System Basis Chip
Interface CAN
Voltage - Supply 5.5V ~ 28V
Package / Case 32-SSOP (0.295", 7.50mm Width) Exposed Pad
Supplier Device Package 32-SOIC-EP
Mounting Type Surface Mount
Base Product Number MCZ33
RoHS Status ROHS3 Compliant
Moisture Sensitivity Level (MSL) 3 (168 Hours)
REACH Status REACH Unaffected
ECCN EAR99
HTSUS 8542.39.0001
Other Names 935324361518
Standard Package 1,000
System Basis Chip Interface 32-SOIC-EP
Contact Information
close