NXP USA Inc. MGD3160AM335EK

MGD3160AM335EK


  • Manufacturer: NXP USA Inc.
  • CONEVO NO: MGD3160AM335EK
  • Package: 32-BSSOP (0.295", 7.50mm Width)
  • Datasheet: -
  • Stock: In stock
  • Description: MGD3160AM335EK(Kg)

Details

Tags

Parameters
Mfr NXP USA Inc.
Series -
Package Tray
Product Status Active
Output Configuration Half Bridge
Applications General Purpose
Interface PWM, SPI
Load Type -
Technology IGBT
Rds On (Typ) 500mOhm
Current - Output / Channel 15A
Current - Peak Output -
Voltage - Supply 4.5V ~ 40V
Voltage - Load 12V ~ 25V
Operating Temperature -40°C ~ 125°C (TA)
Features -
Fault Protection Over Temperature, Short Circuit
Mounting Type Surface Mount
Package / Case 32-BSSOP (0.295", 7.50mm Width)
Supplier Device Package 32-SOIC
Base Product Number MGD3160
RoHS Status ROHS3 Compliant
Moisture Sensitivity Level (MSL) 3 (168 Hours)
REACH Status REACH Unaffected
ECCN EAR99
HTSUS 8542.39.0001
Standard Package 42
Half Bridge Driver General Purpose IGBT 32-SOIC
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