Parameters |
Mfr |
NXP USA Inc. |
Series |
i.MX8MN |
Package |
Tray |
Product Status |
Active |
Core Processor |
ARM® Cortex®-A53, ARM® Cortex®-M7 |
Number of Cores/Bus Width |
4 Core, 64-Bit |
Speed |
1.4GHz |
Co-Processors/DSP |
Multimedia; NEON™ MPE |
RAM Controllers |
DDR3L, DDR4, LPDDR4 |
Graphics Acceleration |
Yes |
Display & Interface Controllers |
LCD, MIPI-CSI, MIPI-DSI |
Ethernet |
GbE |
SATA |
- |
USB |
USB 2.0 OTG + PHY (1) |
Voltage - I/O |
- |
Operating Temperature |
0°C ~ 95°C (TJ) |
Security Features |
ARM TZ, CAAM, HAB, OCRAM, RDC, SJC, SNVS |
Mounting Type |
Surface Mount |
Package / Case |
306-TFBGA |
Supplier Device Package |
306-TFBGA (11x11) |
Additional Interfaces |
AC'97, I²C, I²S, MMC/SD, PCIe, PDM, SAI, SDHC, SPDIF, SPI, TDM, UART |
Base Product Number |
MIMX8MN5 |
RoHS Status |
ROHS3 Compliant |
Moisture Sensitivity Level (MSL) |
3 (168 Hours) |
REACH Status |
REACH Unaffected |
ECCN |
5A992C |
HTSUS |
8542.31.0001 |
Standard Package |
168 |
ARM® Cortex®-A53, ARM® Cortex®-M7 Microprocessor IC i.MX8MN 4 Core, 64-Bit 1.4GHz 306-TFBGA (11x11)