NXP USA Inc. MK53DN512CMD10

MK53DN512CMD10


  • Manufacturer: NXP USA Inc.
  • CONEVO NO: MK53DN512CMD10
  • Package: 144-LBGA
  • Datasheet: PDF
  • Stock: In stock
  • Description: MK53DN512CMD10(Kg)

Details

Tags

Parameters
Program Memory Size 512KB (512K x 8)
Program Memory Type FLASH
EEPROM Size -
RAM Size 128K x 8
Voltage - Supply (Vcc/Vdd) 1.71V ~ 3.6V
Data Converters A/D 41x16b; D/A 2x12b
Oscillator Type Internal
Operating Temperature -40°C ~ 85°C (TA)
Mounting Type Surface Mount
Package / Case 144-LBGA
Supplier Device Package 144-MAPBGA (13x13)
Base Product Number MK53DN512
RoHS Status ROHS3 Compliant
Moisture Sensitivity Level (MSL) 3 (168 Hours)
REACH Status REACH Unaffected
ECCN 3A991A2
HTSUS 8542.31.0001
Other Names 935323265557
Standard Package 160
Mfr NXP USA Inc.
Series Kinetis K50
Package Tray
Product Status Active
Core Processor ARM® Cortex®-M4
Core Size 32-Bit Single-Core
Speed 100MHz
Connectivity EBI/EMI, Ethernet, I²C, IrDA, SD, SPI, UART/USART, USB, USB OTG
Peripherals DMA, I²S, LCD, LVD, POR, PWM, WDT
Number of I/O 94
ARM® Cortex®-M4 Kinetis K50 Microcontroller IC 32-Bit Single-Core 100MHz 512KB (512K x 8) FLASH 144-MAPBGA (13x13)
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