NXP USA Inc. MK60DN512ZAB10R

MK60DN512ZAB10R


  • Manufacturer: NXP USA Inc.
  • CONEVO NO: MK60DN512ZAB10R
  • Package: 120-UFBGA, WLCSP
  • Datasheet: PDF
  • Stock: In stock
  • Description: MK60DN512ZAB10R(Kg)

Details

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Parameters
Mfr NXP USA Inc.
Series Kinetis K60
Package Tape & Reel (TR)
Product Status Obsolete
Core Processor ARM® Cortex®-M4
Core Size 32-Bit Single-Core
Speed 100MHz
Connectivity CANbus, EBI/EMI, Ethernet, I²C, IrDA, SD, SPI, UART/USART, USB, USB OTG
Peripherals DMA, I²S, LVD, POR, PWM, WDT
Program Memory Size 512KB (512K x 8)
Program Memory Type FLASH
EEPROM Size -
RAM Size 128K x 8
Voltage - Supply (Vcc/Vdd) 1.71V ~ 3.6V
Data Converters A/D 38x16b; D/A 2x12b
Oscillator Type Internal
Operating Temperature 0°C ~ 70°C (TA)
Mounting Type Surface Mount
Package / Case 120-UFBGA, WLCSP
Supplier Device Package 120-WLCSP (5.29x5.28)
Base Product Number MK60DN512
RoHS Status ROHS3 Compliant
Moisture Sensitivity Level (MSL) 1 (Unlimited)
REACH Status REACH Unaffected
ECCN 3A991A2
HTSUS 8542.31.0001
Standard Package 3,000
ARM® Cortex®-M4 Kinetis K60 Microcontroller IC 32-Bit Single-Core 100MHz 512KB (512K x 8) FLASH 120-WLCSP (5.29x5.28)
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