NXP USA Inc. MK70FN1M0VMJ12

MK70FN1M0VMJ12


  • Manufacturer: NXP USA Inc.
  • CONEVO NO: MK70FN1M0VMJ12
  • Package: 256-LBGA
  • Datasheet: PDF
  • Stock: In stock
  • Description: MK70FN1M0VMJ12(Kg)

Details

Tags

Parameters
Package / Case 256-LBGA
Supplier Device Package 256-MAPPBGA (17x17)
Base Product Number MK70FN1M0
RoHS Status ROHS3 Compliant
Moisture Sensitivity Level (MSL) 3 (168 Hours)
REACH Status REACH Unaffected
ECCN 3A991A2
HTSUS 8542.31.0001
Other Names 935319892557
Standard Package 90
Mfr NXP USA Inc.
Series Kinetis K70
Package Tray
Product Status Active
Core Processor ARM® Cortex®-M4
Core Size 32-Bit Single-Core
Speed 120MHz
Connectivity CANbus, EBI/EMI, Ethernet, I²C, IrDA, SD, SPI, UART/USART, USB, USB OTG
Peripherals DMA, I²S, LCD, LVD, POR, PWM, WDT
Number of I/O 128
Program Memory Size 1MB (1M x 8)
Program Memory Type FLASH
EEPROM Size -
RAM Size 128K x 8
Voltage - Supply (Vcc/Vdd) 1.71V ~ 3.6V
Data Converters A/D 71x16b; D/A 2x12b
Oscillator Type Internal
Operating Temperature -40°C ~ 105°C (TA)
Mounting Type Surface Mount
ARM® Cortex®-M4 Kinetis K70 Microcontroller IC 32-Bit Single-Core 120MHz 1MB (1M x 8) FLASH 256-MAPPBGA (17x17)
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