NXP USA Inc. MKL33Z256VMP4

MKL33Z256VMP4


  • Manufacturer: NXP USA Inc.
  • CONEVO NO: MKL33Z256VMP4
  • Package: 64-LFBGA
  • Datasheet: PDF
  • Stock: In stock
  • Description: MKL33Z256VMP4(Kg)

Details

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Parameters
Mfr NXP USA Inc.
Series Kinetis KL3
Package Tray
Product Status Active
Core Processor ARM® Cortex®-M0+
Core Size 32-Bit Single-Core
Speed 48MHz
Connectivity I²C, SPI, UART/USART
Peripherals DMA, I²S, LCD, LVD, POR, PWM, WDT
Number of I/O 54
Program Memory Size 256KB (256K x 8)
Program Memory Type FLASH
EEPROM Size -
RAM Size 32K x 8
Voltage - Supply (Vcc/Vdd) 1.71V ~ 3.6V
Data Converters A/D 20x16b; D/A 1x12b
Oscillator Type Internal
Operating Temperature -40°C ~ 105°C (TA)
Mounting Type Surface Mount
Package / Case 64-LFBGA
Supplier Device Package 64-MAPBGA (5x5)
Base Product Number MKL33Z256
RoHS Status ROHS3 Compliant
Moisture Sensitivity Level (MSL) 3 (168 Hours)
REACH Status REACH Unaffected
ECCN 3A991A2
HTSUS 8542.31.0001
Standard Package 640
ARM® Cortex®-M0+ Kinetis KL3 Microcontroller IC 32-Bit Single-Core 48MHz 256KB (256K x 8) FLASH 64-MAPBGA (5x5)
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