NXP USA Inc. MPC5517GAVMG80

MPC5517GAVMG80


  • Manufacturer: NXP USA Inc.
  • CONEVO NO: MPC5517GAVMG80
  • Package: 208-BGA
  • Datasheet: PDF
  • Stock: In stock
  • Description: MPC5517GAVMG80(Kg)

Details

Tags

Parameters
Mfr NXP USA Inc.
Series MPC55xx Qorivva
Package Tray
Product Status Active
Core Processor e200z1
Core Size 32-Bit Single-Core
Speed 80MHz
Connectivity CANbus, EBI/EMI, I²C, SCI, SPI
Peripherals DMA, POR, PWM, WDT
Number of I/O 144
Program Memory Size 1.5MB (1.5M x 8)
Program Memory Type FLASH
EEPROM Size -
RAM Size 80K x 8
Voltage - Supply (Vcc/Vdd) 1.35V ~ 1.65V
Data Converters A/D 40x12b
Oscillator Type External
Operating Temperature -40°C ~ 105°C (TA)
Mounting Type Surface Mount
Package / Case 208-BGA
Supplier Device Package 208-BGA (17x17)
Base Product Number MPC5517
RoHS Status ROHS3 Compliant
Moisture Sensitivity Level (MSL) 3 (168 Hours)
REACH Status REACH Unaffected
ECCN 3A991A2
HTSUS 8542.31.0001
Other Names 935322912557
Standard Package 450
e200z1 MPC55xx Qorivva Microcontroller IC 32-Bit Single-Core 80MHz 1.5MB (1.5M x 8) FLASH 208-BGA (17x17)
Contact Information
close