NXP USA Inc. MPC8313CVRADDC

MPC8313CVRADDC


  • Manufacturer: NXP USA Inc.
  • CONEVO NO: MPC8313CVRADDC
  • Package: 516-BBGA Exposed Pad
  • Datasheet: PDF
  • Stock: In stock
  • Description: MPC8313CVRADDC(Kg)

Details

Tags

Parameters
Operating Temperature -40°C ~ 105°C (TA)
Security Features -
Mounting Type Surface Mount
Package / Case 516-BBGA Exposed Pad
Supplier Device Package 516-TEPBGA (27x27)
Additional Interfaces DUART, HSSI, I²C, PCI, SPI
Base Product Number MPC8313
RoHS Status ROHS3 Compliant
Moisture Sensitivity Level (MSL) 3 (168 Hours)
REACH Status REACH Unaffected
ECCN 3A991A2
HTSUS 8542.31.0001
Other Names 935310343557
Standard Package 200
Mfr NXP USA Inc.
Series MPC83xx
Package Tray
Product Status Active
Core Processor PowerPC e300c3
Number of Cores/Bus Width 1 Core, 32-Bit
Speed 267MHz
Co-Processors/DSP -
RAM Controllers DDR, DDR2
Graphics Acceleration No
Display & Interface Controllers -
Ethernet 10/100/1000Mbps (2)
SATA -
USB USB 2.0 + PHY (1)
Voltage - I/O 1.8V, 2.5V, 3.3V
PowerPC e300c3 Microprocessor IC MPC83xx 1 Core, 32-Bit 267MHz 516-TEPBGA (27x27)
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