NXP USA Inc. MPC8313EZQAFFC

MPC8313EZQAFFC


  • Manufacturer: NXP USA Inc.
  • CONEVO NO: MPC8313EZQAFFC
  • Package: 516-BBGA Exposed Pad
  • Datasheet: PDF
  • Stock: In stock
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Mfr NXP USA Inc.
Series MPC83xx
Package Tray
Product Status Obsolete
Core Processor PowerPC e300c3
Number of Cores/Bus Width 1 Core, 32-Bit
Speed 333MHz
Co-Processors/DSP Security; SEC 2.2
RAM Controllers DDR, DDR2
Graphics Acceleration No
Display & Interface Controllers -
Ethernet 10/100/1000Mbps (2)
SATA -
USB USB 2.0 + PHY (1)
Voltage - I/O 1.8V, 2.5V, 3.3V
Operating Temperature 0°C ~ 105°C (TA)
Security Features Cryptography
Mounting Type Surface Mount
Package / Case 516-BBGA Exposed Pad
Supplier Device Package 516-TEPBGA (27x27)
Additional Interfaces DUART, HSSI, I²C, PCI, SPI
Base Product Number MPC83
RoHS Status RoHS non-compliant
Moisture Sensitivity Level (MSL) 3 (168 Hours)
REACH Status REACH Unaffected
ECCN 5A002A1 NXP
HTSUS 8542.31.0001
Other Names 935323022557
Standard Package 40
PowerPC e300c3 Microprocessor IC MPC83xx 1 Core, 32-Bit 333MHz 516-TEPBGA (27x27)
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