NXP USA Inc. MPC8313ZQAFFC

MPC8313ZQAFFC


  • Manufacturer: NXP USA Inc.
  • CONEVO NO: MPC8313ZQAFFC
  • Package: 516-BBGA Exposed Pad
  • Datasheet: PDF
  • Stock: In stock
  • Description: MPC8313ZQAFFC(Kg)

Details

Tags

Parameters
Mfr NXP USA Inc.
Series *
Package Tray
Product Status Obsolete
Mounting Type Surface Mount
Package / Case 516-BBGA Exposed Pad
Supplier Device Package 516-TEPBGA (27x27)
Base Product Number MPC83
RoHS Status RoHS non-compliant
Moisture Sensitivity Level (MSL) 3 (168 Hours)
REACH Status REACH Unaffected
ECCN 3A991A2
HTSUS 8542.31.0001
Other Names 935314272557
Standard Package 40
Microprocessor IC * 516-TEPBGA (27x27)
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