NXP USA Inc. MPC8377ECVRANGA

MPC8377ECVRANGA


  • Manufacturer: NXP USA Inc.
  • CONEVO NO: MPC8377ECVRANGA
  • Package: 689-BBGA Exposed Pad
  • Datasheet: PDF
  • Stock: In stock
  • Description: MPC8377ECVRANGA(Kg)

Details

Tags

Parameters
Mounting Type Surface Mount
Package / Case 689-BBGA Exposed Pad
Supplier Device Package 689-TEPBGA II (31x31)
Additional Interfaces DUART, I²C, MMC/SD, PCI, SPI
Base Product Number MPC8377
RoHS Status ROHS3 Compliant
Moisture Sensitivity Level (MSL) 3 (168 Hours)
REACH Status REACH Unaffected
ECCN 5A002A1 NXP
HTSUS 8542.31.0001
Other Names 935325621557
Standard Package 27
Mfr NXP USA Inc.
Series MPC83xx
Package Tray
Product Status Obsolete
Core Processor PowerPC e300c4s
Number of Cores/Bus Width 1 Core, 32-Bit
Speed 800MHz
Co-Processors/DSP Security; SEC 3.0
RAM Controllers DDR, DDR2
Graphics Acceleration No
Display & Interface Controllers -
Ethernet 10/100/1000Mbps (2)
SATA SATA 3Gbps (2)
USB USB 2.0 + PHY (1)
Voltage - I/O 1.8V, 2.5V, 3.3V
Operating Temperature -40°C ~ 125°C (TA)
Security Features Cryptography, Random Number Generator
PowerPC e300c4s Microprocessor IC MPC83xx 1 Core, 32-Bit 800MHz 689-TEPBGA II (31x31)
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