NXP USA Inc. MPC8379EVRAJFA

MPC8379EVRAJFA


  • Manufacturer: NXP USA Inc.
  • CONEVO NO: MPC8379EVRAJFA
  • Package: 689-BBGA Exposed Pad
  • Datasheet: -
  • Stock: In stock
  • Description: MPC8379EVRAJFA(Kg)

Details

Tags

Parameters
Mfr NXP USA Inc.
Series *
Package Tray
Product Status Obsolete
Mounting Type Surface Mount
Package / Case 689-BBGA Exposed Pad
Supplier Device Package 689-TEPBGA II (31x31)
Base Product Number MPC8379
RoHS Status ROHS3 Compliant
Moisture Sensitivity Level (MSL) 3 (168 Hours)
REACH Status REACH Unaffected
ECCN 5A002A1
HTSUS 8542.31.0001
Other Names 935323185557
Standard Package 27
Microprocessor IC * 689-TEPBGA II (31x31)
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