NXP USA Inc. MPC8555ECPXALF

MPC8555ECPXALF


  • Manufacturer: NXP USA Inc.
  • CONEVO NO: MPC8555ECPXALF
  • Package: 783-BBGA, FCBGA
  • Datasheet: PDF
  • Stock: In stock
  • Description: MPC8555ECPXALF(Kg)

Details

Tags

Parameters
Graphics Acceleration No
Display & Interface Controllers -
Ethernet 10/100/1000Mbps (2)
SATA -
USB USB 2.0 (1)
Voltage - I/O 2.5V, 3.3V
Operating Temperature -40°C ~ 105°C (TA)
Security Features Cryptography, Random Number Generator
Mounting Type Surface Mount
Package / Case 783-BBGA, FCBGA
Supplier Device Package 783-FCPBGA (29x29)
Additional Interfaces DUART, I²C, PCI, SPI, TDM, UART
Base Product Number MPC85
RoHS Status RoHS non-compliant
Moisture Sensitivity Level (MSL) 3 (168 Hours)
REACH Status REACH Unaffected
ECCN 5A002A1 FRE
HTSUS 8542.31.0001
Other Names 935325241557
Standard Package 36
Mfr NXP USA Inc.
Series MPC85xx
Package Tray
Product Status Obsolete
Core Processor PowerPC e500
Number of Cores/Bus Width 1 Core, 32-Bit
Speed 667MHz
Co-Processors/DSP Communications; CPM, Security; SEC
RAM Controllers DDR, SDRAM
PowerPC e500 Microprocessor IC MPC85xx 1 Core, 32-Bit 667MHz 783-FCPBGA (29x29)
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