NXP USA Inc. MPC8555ECVTALF

MPC8555ECVTALF


  • Manufacturer: NXP USA Inc.
  • CONEVO NO: MPC8555ECVTALF
  • Package: 783-BBGA, FCBGA
  • Datasheet: PDF
  • Stock: In stock
  • Description: MPC8555ECVTALF(Kg)

Details

Tags

Parameters
Mfr NXP USA Inc.
Series MPC85xx
Package Tray
Product Status Obsolete
Core Processor PowerPC e500
Number of Cores/Bus Width 1 Core, 32-Bit
Speed 667MHz
Co-Processors/DSP Communications; CPM, Security; SEC
RAM Controllers DDR, SDRAM
Graphics Acceleration No
Display & Interface Controllers -
Ethernet 10/100/1000Mbps (2)
SATA -
USB USB 2.0 (1)
Voltage - I/O 2.5V, 3.3V
Operating Temperature -40°C ~ 105°C (TA)
Security Features Cryptography, Random Number Generator
Mounting Type Surface Mount
Package / Case 783-BBGA, FCBGA
Supplier Device Package 783-FCPBGA (29x29)
Additional Interfaces DUART, I²C, PCI, SPI, TDM, UART
Base Product Number MPC85
RoHS Status ROHS3 Compliant
Moisture Sensitivity Level (MSL) 3 (168 Hours)
REACH Status REACH Unaffected
ECCN 5A002A1 FRE
HTSUS 8542.31.0001
Other Names 935325242557
Standard Package 36
PowerPC e500 Microprocessor IC MPC85xx 1 Core, 32-Bit 667MHz 783-FCPBGA (29x29)
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