NXP USA Inc. MPC8555VTAQF

MPC8555VTAQF


  • Manufacturer: NXP USA Inc.
  • CONEVO NO: MPC8555VTAQF
  • Package: 783-BBGA, FCBGA
  • Datasheet: PDF
  • Stock: In stock
  • Description: MPC8555VTAQF(Kg)

Details

Tags

Parameters
REACH Status REACH Unaffected
ECCN 3A001A3
HTSUS 8542.31.0001
Standard Package 36
Mfr NXP USA Inc.
Series MPC85xx
Package Tray
Product Status Obsolete
Core Processor PowerPC e500
Number of Cores/Bus Width 1 Core, 32-Bit
Speed 1.0GHz
Co-Processors/DSP Communications; CPM
RAM Controllers DDR, SDRAM
Graphics Acceleration No
Display & Interface Controllers -
Ethernet 10/100/1000Mbps (2)
SATA -
USB USB 2.0 (1)
Voltage - I/O 2.5V, 3.3V
Operating Temperature 0°C ~ 105°C (TA)
Security Features -
Mounting Type Surface Mount
Package / Case 783-BBGA, FCBGA
Supplier Device Package 783-FCPBGA (29x29)
Additional Interfaces DUART, I²C, PCI, SPI, TDM, UART
Base Product Number MPC85
RoHS Status ROHS3 Compliant
Moisture Sensitivity Level (MSL) 3 (168 Hours)
PowerPC e500 Microprocessor IC MPC85xx 1 Core, 32-Bit 1.0GHz 783-FCPBGA (29x29)
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