NXP USA Inc. MPF5030BMMA4ES

MPF5030BMMA4ES


  • Manufacturer: NXP USA Inc.
  • CONEVO NO: MPF5030BMMA4ES
  • Package: 40-VFQFN Exposed Pad
  • Datasheet: -
  • Stock: In stock
  • Description: MPF5030BMMA4ES(Kg)

Details

Tags

Parameters
Mfr NXP USA Inc.
Series -
Package Tray
Product Status Active
Applications System Basis Chip
Current - Supply -
Operating Temperature -40°C ~ 125°C (TA)
Mounting Type Surface Mount, Wettable Flank
Package / Case 40-VFQFN Exposed Pad
Supplier Device Package 40-HVQFN (6x6)
RoHS Status ROHS3 Compliant
Moisture Sensitivity Level (MSL) 3 (168 Hours)
Other Names 568-MPF5030BMMA4ES
Standard Package 490
System Basis Chip PMIC 40-HVQFN (6x6)
Contact Information
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