NXP USA Inc. MSC8103VT1100F

MSC8103VT1100F


  • Manufacturer: NXP USA Inc.
  • CONEVO NO: MSC8103VT1100F
  • Package: 332-BFBGA, FCBGA
  • Datasheet: PDF
  • Stock: In stock
  • Description: MSC8103VT1100F(Kg)

Details

Tags

Parameters
Mfr NXP USA Inc.
Series StarCore
Package Tray
Product Status Obsolete
Type SC140 Core
Interface Communications Processor Module (CPM)
Clock Rate 275MHz
Non-Volatile Memory External
On-Chip RAM 512kB
Voltage - I/O 3.30V
Voltage - Core 1.60V
Operating Temperature -40°C ~ 105°C (TJ)
Mounting Type Surface Mount
Package / Case 332-BFBGA, FCBGA
Supplier Device Package 332-FCBGA (17x17)
Base Product Number MSC81
RoHS Status ROHS3 Compliant
Moisture Sensitivity Level (MSL) 3 (168 Hours)
REACH Status REACH Unaffected
ECCN 3A001A3
HTSUS 8542.31.0001
Standard Package 90
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