NXP USA Inc. MSC8113TMP3600V

MSC8113TMP3600V


  • Manufacturer: NXP USA Inc.
  • CONEVO NO: MSC8113TMP3600V
  • Package: 431-BFBGA, FCBGA
  • Datasheet: PDF
  • Stock: In stock
  • Description: MSC8113TMP3600V(Kg)

Details

Tags

Parameters
Mfr NXP USA Inc.
Series StarCore
Package Tray
Product Status Obsolete
Type SC140 Core
Interface Ethernet, I²C, TDM, UART
Clock Rate 300MHz
Non-Volatile Memory External
On-Chip RAM 1.436MB
Voltage - I/O 3.30V
Voltage - Core 1.10V
Operating Temperature -40°C ~ 105°C (TJ)
Mounting Type Surface Mount
Package / Case 431-BFBGA, FCBGA
Supplier Device Package 431-FCPBGA (20x20)
Base Product Number MSC81
RoHS Status RoHS non-compliant
Moisture Sensitivity Level (MSL) 3 (168 Hours)
REACH Status REACH Unaffected
ECCN 3A991A2
HTSUS 8542.31.0001
Standard Package 60
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